27C1001 DATASHEET PDF

27C1001 DATASHEET PDF

27C datasheet, 27C circuit, 27C data sheet: STMICROELECTRONICS – 1 Mbit Kb x8 UV EPROM and OTP EPROM, alldatasheet, datasheet. 27C 1 Mbit kb x8 UV Eprom and OTP Eprom. ± 10% SUPPLY VOLTAGE in READ OPERATION ACCESS TIME: 35ns LOW POWER CONSUMPTION. Date. 1) Reduce operating current change from 40mA to 30mA. 5/28/ 2) Eliminate Interactive Programming Mode. 3) Add 27C pin configuration.

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Input Rise and Fall Times. Two Line Output Control.

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Chip Enable E is the power control and should be used for device selection. The updated every day, always provide the best quality and speed. A high level E input inhibits the other M27Cs from being programmed. This publication supersedes and replaces all information previously supplied.

27C1001 Datasheet PDF – STMicroelectronics

Ordering Information Scheme Example: Speed obtained with High Speed AC measurement conditions. However, STMicroeiectronics assumes no responsibility for the consequences of use of such information nor for any infringement of datashet or other rights of third parties which may result from its use. Address Transition to Output Transition. Exposure to Absolute Maximum Rating condi- tions for extended periods may affect device reliability.

Maximum DC voltage on Output is V. Output Enable G is the output control and should be used to gate data to the output pins, indepen- dent of device selection. The two line control function allows: Address Valid to Output Valid. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm.

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Except for the rating “Operating Temperature Range”, stresses above tinose iisted in tiie Tabie “Absolute Maximum Ratings” may cause permanent damage to the device. Vcc must be applied simultaneously with or before Vpp and removed simultaneously or after Vpp.

27C Datasheet PDF ( Pinout ) – 1 Mbit Kb x8 UV EPROM and OTP EPROM

The FDIP32W window ceramic frit-seal package and the LCCC32W leadless chip carrier package have a transparent lids which allow the user to ex- pose the chip to ultraviolet light to erase the bit pat- tern. The associated transient voltage peaks can be suppressed by complying with the two line output control 27c10001 by properly selected decoupling capacitors.

For the most efficient use of these two control lines, E should be decoded and used as the prima- ry device selecting function, while G should be made a common connection to datasueet devices in the array and connected to the READ line from the system control bus.

The recommended erasure pro- cedure for the M27C is exposure to short wave ultraviolet light which has a wavelength of A.

For applications where datashewt content is programmed.

Chip Enable High to. Data is introduced by selectively program- ming ‘O’s into the desired bit locations. The two line control function allows: TSOP32 8 x 20 mm packages.

It offers a large amount of data sheet, You can free PDF files download. A new pattern can then be written to the device by following the programming procedure. A single power sup- ply is required in the read mode. Read Mode AC Characteristics 1.

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I CC Supply Current. Speed obtained with High Speed AC measurement conditions.

IC Datasheet: 27C EPROM Data Sheet : Free Download, Borrow, and Streaming : Internet Archive

AC Testing Load Circuit 1. Ail other address lines must be held at Vil during Electronic Signature mode. The FDIP32W window ceramic frit-seal package and the Ddatasheet leadless chip carrier dayasheet have a transparent lids which allow the user to ex- pose the chip to ultraviolet light to erase the bit pat- tern. A new pattern can then be written to the device by following the programming procedure. If the M27C is datashret be exposed to these types of lighting conditions for extended pe- riods of time, it is suggested that opaque labels be put over the M27C window to prevent unin- tentional erasure.

To activate the Datasyeet mode, the programming equipment must force Chip Enable E is the power control and shoUd be used for device selection. The FDIP32W window ceramic frit-seal package and the LCCC32W leadless chip carrier package have a transparent lids which allow the user to ex- pose the chip to ultraviolet light to erase the bit pat- tern. The bulk capacitor should be located near the power supply connection point.